TSMC To Produce Next-Gen Entry, Mid & High-End Intel Core CPUs on 5nm & 3nm Process Nodes Starting 2H 2022
TSMC To Produce Intel Cadre i3 CPUs on 5nm Process Node in 2H 2021, 3nm Mainstream & Loftier-Finish CPUs Enter Mass Production in 2H 2022
11th Gen Intel Cadre desktop processors (code-named "Rocket Lake-S") will deliver inceased performance and speeds. They will launch in the first quarter of 2021. (Credit: Intel Corporation)
In a presser, TrendForce has announced that as per their investigation, TSMC volition be mass-producing Intel'southward adjacent-generation entry-level, mid-range and high-end CPUs on its 5nm and 3nm procedure nodes. Intel has already announced that it volition be outsourcing several of its non-CPU chips to 3rd party foundries but this major news confirms that they are planning to movement fifty-fifty their biggest product lineups to external fabs.
Intel's Adjacent-Gen Core i3 CPUs To Be Produced on TSMC's 5nm Procedure Node, Loftier-End & Mid-Range CPUs To Be Produced on TSMC's 3nm Node in 2H 2022
It looks like afterwards Alder Lake in 2H 2021, Intel will be moving to TSMC as its prime partner in mass-producing its next-generation CPU lineup. The press release states that Intel'south Core i3 CPUs volition exist the first mass-production lineup made at TSMC and will be utilizing its 5nm process node. Exercise note that mass product doesn't exactly means a hard launch and we might end up getting these chips later on around 2022. With that said, Alder Lake CPUs will focus on loftier-performance while utilizing the 10nm Enhanced SuperFin process node.
But Intel plans to shift its entire mid-range and high-performance lineup to TSMC by 2H 2022. The adjacent-generation processors will be featuring the more avant-garde 3nm process node from TSMC & will be the successors to the Alder Lake lineup. It is non known whether these will be mobility or desktop parts but from the looks of where things are headed, Intel might utilize TSMC for mass production of both segments.
Press Release - Intel has outsourced the production of about 15-20% of its non-CPU chips, with nigh of the wafer starts for these products assigned to TSMC and UMC, co-ordinate to TrendForce'south latest investigations. While the company is planning to kick off mass product of Core i3 CPUs at TSMC's 5nm node in 2H21, Intel'southward mid-range and high-end CPUs are projected to enter mass production using TSMC'south 3nm node in 2H22.
In recent years, Intel has experienced some setbacks in the development of 10nm and 7nm processes, which in turn profoundly hindered its competitiveness in the market place. With regards to smartphone processors, most of which are based on the ARM architecture, Apple and HiSilicon have been able to announce the most advanced mobile AP-SoC ahead of their competitors, thanks to TSMC'due south technical breakthroughs in process technology.
With regards to CPUs, AMD, which is besides outsourcing its CPU production to TSMC, is progressively threatening Intel'due south PC CPU marketplace share. Furthermore, Intel lost CPU orders for the MacBook and Mac Mini, since both of these products are now equipped with Apple Silicon M1 processors, which were announced past Apple last year and manufactured past TSMC. The aforementioned shifts in the smartphone and PC CPU markets led Intel to announce its intention to outsource CPU manufacturing in 2H20.
TrendForce believes that increased outsourcing of its product lines will allow Intel to non only continue its existence as a major IDM, but too maintain in-house product lines for chips with high margins, while more effectively spending CAPEX on avant-garde R&D. In improver, TSMC offers a diverse range of solutions that Intel can use during product development (e.yard., chiplets, CoWoS, InFO, and SoIC). All in all, Intel will be more flexible in its planning and have access to diverse value-added opportunities past employing TSMC'southward product lines. At the same time, Intel now has a chance to be on the same level every bit AMD with respect to manufacturing CPUs with advanced procedure technologies.
Intel had previously confirmed that DG1, Tiger Lake, and SG1 (a flavor of DG1 designed for servers) will exist manufactured in-house on the Intel 10nm SuperFin process. The upcoming Intel Xe HPG GPU for gamers will be made on an external foundry procedure - quite likely TSMC (and probably the 7nm process because the 2021 timeline).
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Source: https://wccftech.com/tsmc-mass-produce-intel-core-cpus-5nm-3nm-process-nodes-2h-2021-2022/
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